Reliability Test Methodology Reliability tests are conducted for each product series, such as the design/process family or package family, in order to execute the approval test effectively. KAWASAKI MICROELECTRONICS,INC. follows the industry-defined set of stress tests to qualify our ASIC products. Many stress and conformance tests are conducted on packaged products using sampling plans and test methods that enable customers to have confidence in the quality and reliability of products shipped from KAWASAKI MICROELECTRONICS,INC. The results of these tests are published for each product, for customers to review. The Reliability test items are as follows; 　 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 　Solderability 　Resistance to Soldering Heat 　Terminal Strength 　Temperature Cycling 　Thermal Shock 　Pressure Temperature Humidity Bias or Temperature Humidity Bias 　Electrostatic Discharge 　High Temperature Storage 　High Temperature Operation (Semi-Dynamic) 　Low Temperature Operation (Semi-Dynamic) 　Latch-up Reliability equipment List
	Reliability Test Equipment Failure Analysis Equipment HAST Chamber EB Tester Oven HE Analyzer Thermo-humidistatic Chamber Soft X-Ray Inspection Machine Temperature Cycling Chamber Pull Strength Tester Thermal Shock Chamber Wire pull & Ball shear Strength tester Burn-in test system Scanning Acoustic Microscopy Solderability FIB Solder bath SEM+EDX IRS SEM ESD & Latch up IC Backside Polishing system ESD Precision Saw . Grinder&Polisher . Plasma Etching system . Plastic Mold Opener